EMIF02-MIC03F2点击型号即可查看芯片规格书
芯片规格书搜索工具-icspec
产品概述
描述
The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.
This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.
所有功能
- EMI symmetrical (I/O) low-pass filter
- High efficiency in EMI filtering
- Very low PCB space consuming:1.07 mm x 1.47 mm
- Very thin package: 0.65 mm
- High efficiency in ESD suppression
- High reliability offered by monolithic integration
- High reducing of parasitic elements through integration and wafer level packaging
- Complies with the following standards:
- IEC 61000-4-2 level 4, on input pins
- 15 kV (air discharge)
- 8 kV (contact discharge)
- IEC 61000-4-2 Level 1, on output pins
- 2 kV (air discharge)
- 2 kV (contact discharge)
- MIL STD 883E - Method 3015-6 Class 3
